FSI International Receives a Follow-On Order for its ORION(R) System from Leading Semiconductor Producer

MINNEAPOLIS — 02/07/2012 (CRWENEWSWIRE) — FSI International, Inc. (Nasdaq:FSII), a leading manufacturer of surface conditioning equipment for microelectronics manufacturing, announced today that it received a follow-on order for its ORION(R) Single Wafer Cleaning System from a leading semiconductor producer. The system will be used for FEOL applications. The company expects to ship the system in the second half of fiscal 2012.*

Leading integrated circuit manufacturers are finding that the unique closed chamber design of the ORION(R) System, when used for FEOL applications, permits use of high-temperature ViPRâ„¢ process technology for selective metal etching and all-wet removal of highly implanted photoresist. FSI’s differentiated ViPRâ„¢ technology minimizes material loss, lowers defectivity and has proven cost of ownership advantages.

FSI International, Inc. is a global supplier of surface conditioning equipment, technology and support services for microelectronics manufacturing. Using the company’s broad portfolio of cleaning products, which include batch and single-wafer platforms for immersion, spray and cryogenic aerosol technologies, customers are able to achieve their process performance flexibility and productivity goals. The company’s support services programs provide product and process enhancements to extend the life of installed FSI equipment, enabling worldwide customers to realize a higher return on their capital investment. For more information, visit FSI’s website at http://www.fsi-intl.com.

“Safe Harbor� Statement Under the Private Securities Litigation Reform Act of 1995

This press release contains certain “forward-looking� statements (*), including, but not limited to the expected second half fiscal 2012 shipment. Except for the historical information contained herein, the matters discussed in this news release are forward-looking statements involving risks and uncertainties, both known and unknown, that could cause actual results to differ materially from those in such forward-looking statements. Such risks and uncertainties include, but are not limited to, changes in industry conditions; order delays or cancellations; general economic conditions; changes in customer capacity requirements and demand for microelectronics; the extent of demand for the company’s products and its ability to meet demand; global trade policies; worldwide economic and political stability; the company’s successful execution of internal performance plans; the cyclical nature of the company’s business; volatility of the market for certain products; performance issues with key suppliers and subcontractors; the level of new orders; the timing and success of current and future product and process development programs; the success of the company’s direct distribution organization; legal proceedings; the potential impairment of long-lived assets; and the potential adverse financial impacts resulting from declines in the fair value and liquidity of investments the company presently holds; the impact of natural disasters on parts supply and demand for products; as well as other factors listed herein or from time to time in the company’s SEC reports, including our latest 10-K annual report and 10-Q quarterly reports. The company assumes no duty to update the information in this press release.

Source: FSI International, Inc.

Contact:
FSI International, Inc.
Benno Sand, 952-448-8936
Investor and Financial Media

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